Agglomeration of Copper Thin Film in Cu/Ta/Si Structure
نویسندگان
چکیده
منابع مشابه
Copper–titanium thin film interaction
Interaction between 5 lm thick copper and 50 nm thin titanium films was investigated as a function of annealing temperature and time using MeV He Rutherford backscattering, X-ray diffraction and dynamic Secondary Ion Mass Spectrometry. Samples were made by depositing 10 nm of titanium on a PECVD silicon oxynitride, followed by 50 nm of titanium nitride and 50 nm of titanium in the said order. I...
متن کاملQuantitative Modeling and Measurement of Copper Thin Film Adhesion
Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The primary mechanism is the thermodynamic work of adhesion of the interface, which in its most basic description is the difference between the surface energies of the two materials and that of the interface. This quantity is often described as leveraging the contributions of other mechanisms. One of...
متن کاملAb initio structure modelling of complex thin-film oxides: thermodynamical stability of TiC/thin-film alumina.
We present a strategy to identify energetically favourable oxide structures in thin-film geometries. Thin-film candidate configurations are constructed from a pool of sublattices of stable and metastable oxide bulk phases. Favourable stoichiometric compositions and atomic geometries are identified by comparing total and Gibbs free energies of the relaxed configurations. This strategy is illustr...
متن کاملCopper (II) oxide thin film for methanol and ethanol sensing
A nanostructured copper (II) oxide film deposited by reactive DC-magnetron sputtering technique, has been studied for static sensor response towards methanol and ethanol by operating temperature and analyte concentration modulations. The optimum operating temperature (Topt) for the sensing of methanol and ethanol is observed to be 350 ̊C and 400 ̊C, respectively. The maximum sensitivity observe...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2004
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.45.877